Silicon Valley Branch Office

2043 Zanker Road
San Jose, CA 95131
Telephone: 408-501-1400
Fax: 408-501-1499


Epson Products

EPSON-LOGO-2006

NS8000

High-Speed IC Test Handler

Model: NS8000 series

NS8020 / NS8040 are direct replacement of NS6000 series.

Features:

1) High-Speed: Max. 8300UPH (Octal)

2) Various Selections: NS8020 / NS8040 / NS8080

3) Super-Stable Pick & Place of Small Devices (Min. 2x2mm)

4) Changeover Kits compatible with the other NS-series

5) Easy Operation / Easy Maintenance

6) Flexible Socket Pitch with Easy Changeover

 

Basic Specifications

Model NS8020 NS8040 NS8080
Device Type / Size

QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA

Min. 2x2mm – Max. 50x50mm (Lead Pitch: 0.4mm or more)

Test Mode

Square Quad (2×2)

Inline Quad (1×4)

Dual / Single

Octal (4×2)

 Square Quad (2×2)

Inline Quad (1×4)

Dual / Single

Socket Area 184 x 130mm
Standard Socket Pitch

Square Quad: 80mm (X) x 60mm (Y)

Inline Quad: 40mm (X)

Dual: 80mm (X)

Octal: 40mm (X) x 60mm (Y)
Heating Method Heating Plate Heating Chamber
Min. Index Time 0.39 sec. 0.36 sec.
Max. Throughput 5400UPH (Quad) 8000UPH (Quad) 8300UPH (Octal)
Temperature

Ambient / Hot

+50°C – +90°C ±2°C

+90°C – +130°C ±3°C

Standard Tray Size JEDEC Trays (135.9 x 315.0mm)
Binning 6 Hardware Binning (3 Auto / 3 Manual) 5 Hardware Binning (3 Auto / 2 Manual)
Power Single-Phase AC200-240V 50/60Hz 6kVA
Dimensions 1700(W) x 1500(D) x 1760(H) mm 1860(W) x 1500(D) x 1760(H) mm
Weight Approx. 920kg Approx. 960kg

 

NS8000

High-Speed IC Test Handler

Model: NS8000W series

Wide Version of NS8000 series

Features:

1) High-Speed: Max. 8300UPH (Octal)

2) Two Version: Wide & Super-Wide

3) High Contact Pressure option (2400N)

4) Super-Stable Pick & Place of Small Devices (Min. 2x2mm)

5) Changeover Kits compatible with the other NS-series

6) Easy Operation / Easy Maintenance

7) Flexible Socket Pitch with Easy Changeover

 

Basic Specifications

Model NS8080W NS8160W NS8160SW
Device Type / Size

QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA

Min. 2x2mm – Max. 50x50mm (Lead Pitch: 0.4mm or more)

Test Mode

Octal (4×2)

Square Quad (2×2)

Inline Quad (1×4)

Dual / Single

16 sites (8×2)

Octal (4×2)

Square Quad (2×2)

Inline Quad (1×4)

Dual / Single

Socket Area 260 x 130mm
Standard Socket Pitch

16 sites (optional): 30mm (X) x 60mm (Y)

Octal: 60mm (X) x 60mm (Y)

Square Quad: 80mm (X) x 60mm (Y)

Inline Quad: 40mm (X)

Dual: 80mm (X)

16 sites: 40mm (X) x 60mm (Y)

Octal: 80mm (X) x 60mm (Y)

Heating Method Heating Chamber
Min. Index Time 0.4 sec.
Max. Throughput 8300UPH
Temperature

Ambient / Hot

+50°C – +90°C ±2°C

+90°C – +130°C ±3°C

Standard Tray Size JEDEC Trays (135.9 x 315.0mm)
Binning 5 Hardware Binning (3 Auto / 2 Manual) 5 Hardware Binning (3 Auto / 1.5 Manual)
Power Single-Phase AC200-240V 50/60Hz 6kVA
Dimensions 1860(W) x 1500(D) x 1760(H) mm 1860(W) x 1500(D) x 2140(H) mm
Weight Approx. 1040kg Approx. 1070kg

 

NS7000

High-Speed IC Test Handler

Model: NS7000 series

 

Features:

1) High-Speed: Max. 7300UPH (Octal)

2) Wide version for wider socket pitch

3) Stable Pick & Place of Small Devices (Min. 3x3mm)

4) Changeover Kits compatible with the other NS-series

5) Easy Operation / Easy Maintenance

6) Flexible Socket Pitch with Easy Changeover

 

Basic Specifications

Model NS7000 NS7080 NS7080SW NS7160W
Device Type / Size

QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA

Min. 2x2mm – Max. 50x50mm (Lead Pitch: 0.4mm or more)

Test Mode

Square Quad (2×2)

Inline Quad (1×4)

Dual / Single

Octal (4×2)

Square Quad (2×2)

Inline Quad (1×4)

Dual / Single

16 sites (8×2)

Octal (4×2)

Square Quad (2×2)

Inline Quad (1×4)

Dual / Single

Socket Area 184 x 130mm 260 x 130mm
Standard Socket Pitch

Square Quad: 80mm (X) x 60mm (Y)

Inline Quad: 40mm (X)

Dual: 80mm (X)

16 sites (optional): 30mm (X) x 60mm (Y)

Wide Octal: 60mm (X) x 60mm (Y)

Standard Octal: 40mm (X) x 60mm (Y)

Heating Method Heating Chamber
Min. Index Time

0.36 sec. (Inline Quad / Dual / Single)

0.39 sec. (Square Quad / Octal / 16 sites)

Max. Throughput 7300UPH (Octal / Quad)
Temperature

Ambient / Hot

+50°C – +90°C ±2°C

+90°C – +130°C ±3°C

Standard Tray Size JEDEC Trays (135.9 x 315.0mm)
Binning 6 Hardware Binning (3 Auto / 3 Manual) 5 Hardware Binning (3 Auto / 2 Manual)
Power Single-Phase AC200-240V 50/60Hz 6kVA
Dimensions 1640(W) x 1580(D) x 1860(H) mm 1800(W) x 1580(D) x 1860(H) mm
Weight Approx. 1120kg Approx. 1190kg

 

 

TR60

High-Speed IC Test Handler

Model: TR60

 

Features:

1) Tri-Temp. Capability (-60 – +140°C)

2) Stable Pick & Place of Small Devices (Min. 3x3mm)

3) Loadboard Compatible with NS-series

4) Max. Throughput: 4000UPH

5) Vertical Docking

 

Basic Specifications

Model TR60
Device Type / Size

QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA

Min. 2x2mm – Max. 32x32mm (Lead Pitch: 0.4mm or more)

Test Mode

Square Quad (2×2)

Inline Quad (1×4)

Dual / Single

Standard Socket Pitch

Square Quad: 80mm (X) x 60mm (Y)

Inline Quad: 40mm (X)

Dual: 80mm (X)

Min. Index Time 0.65 sec.
Max. Throughput 4000UPH (Quad)
Temperature

-40°C – +140°C ±4°C (Standard)

-60°C – -40°C ±5°C (Optical)

Standard Tray Size JEDEC Trays (135.9 x 315.0mm)
Binning

6 Hardware Binning (3 Auto / 3 Manual)

15 Software Binning

Power Triple-Phase AC200-240V 50/60Hz 10kVA
Dimensions 1570(W) x 1270(D) x 1880(H) mm
Weight Approx. 1200kg