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2154 Paragon Drive
San Jose, CA 95131
Telephone: 408-501-1400
Fax: 408-501-1499
Epson Products
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High-Speed IC Test HandlerModel: NS8000 seriesNS8020 / NS8040 are direct replacement of NS6000 series. Features: 1) High-Speed: Max. 8300UPH (Octal) 2) Various Selections: NS8020 / NS8040 / NS8080 3) Super-Stable Pick & Place of Small Devices (Min. 2x2mm) 4) Changeover Kits compatible with the other NS-series 5) Easy Operation / Easy Maintenance 6) Flexible Socket Pitch with Easy Changeover |
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Basic Specifications |
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| Model | NS8020 | NS8040 | NS8080 |
| Device Type / Size |
QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Min. 2x2mm – Max. 50x50mm (Lead Pitch: 0.4mm or more) |
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| Test Mode |
Square Quad (2×2) Inline Quad (1×4) Dual / Single |
Octal (4×2) Square Quad (2×2) Inline Quad (1×4) Dual / Single |
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| Socket Area | 184 x 130mm | ||
| Standard Socket Pitch |
Square Quad: 80mm (X) x 60mm (Y) Inline Quad: 40mm (X) Dual: 80mm (X) |
Octal: 40mm (X) x 60mm (Y) | |
| Heating Method | Heating Plate | Heating Chamber | |
| Min. Index Time | 0.39 sec. | 0.36 sec. | |
| Max. Throughput | 5400UPH (Quad) | 8000UPH (Quad) | 8300UPH (Octal) |
| Temperature |
Ambient / Hot +50°C – +90°C ±2°C +90°C – +130°C ±3°C |
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| Standard Tray Size | JEDEC Trays (135.9 x 315.0mm) | ||
| Binning | 6 Hardware Binning (3 Auto / 3 Manual) | 5 Hardware Binning (3 Auto / 2 Manual) | |
| Power | Single-Phase AC200-240V 50/60Hz 6kVA | ||
| Dimensions | 1700(W) x 1500(D) x 1760(H) mm | 1860(W) x 1500(D) x 1760(H) mm | |
| Weight | Approx. 920kg | Approx. 960kg | |
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High-Speed IC Test HandlerModel: NS8000W seriesWide Version of NS8000 series Features: 1) High-Speed: Max. 8300UPH (Octal) 2) Two Version: Wide & Super-Wide 3) High Contact Pressure option (2400N) 4) Super-Stable Pick & Place of Small Devices (Min. 2x2mm) 5) Changeover Kits compatible with the other NS-series 6) Easy Operation / Easy Maintenance 7) Flexible Socket Pitch with Easy Changeover |
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Basic Specifications |
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| Model | NS8080W | NS8160W | NS8160SW |
| Device Type / Size |
QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Min. 2x2mm – Max. 50x50mm (Lead Pitch: 0.4mm or more) |
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| Test Mode |
Octal (4×2) Square Quad (2×2) Inline Quad (1×4) Dual / Single |
16 sites (8×2) Octal (4×2) Square Quad (2×2) Inline Quad (1×4) Dual / Single |
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| Socket Area | 260 x 130mm | ||
| Standard Socket Pitch |
16 sites (optional): 30mm (X) x 60mm (Y) Octal: 60mm (X) x 60mm (Y) Square Quad: 80mm (X) x 60mm (Y) Inline Quad: 40mm (X) Dual: 80mm (X) |
16 sites: 40mm (X) x 60mm (Y) Octal: 80mm (X) x 60mm (Y) |
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| Heating Method | Heating Chamber | ||
| Min. Index Time | 0.4 sec. | ||
| Max. Throughput | 8300UPH | ||
| Temperature |
Ambient / Hot +50°C – +90°C ±2°C +90°C – +130°C ±3°C |
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| Standard Tray Size | JEDEC Trays (135.9 x 315.0mm) | ||
| Binning | 5 Hardware Binning (3 Auto / 2 Manual) | 5 Hardware Binning (3 Auto / 1.5 Manual) | |
| Power | Single-Phase AC200-240V 50/60Hz 6kVA | ||
| Dimensions | 1860(W) x 1500(D) x 1760(H) mm | 1860(W) x 1500(D) x 2140(H) mm | |
| Weight | Approx. 1040kg | Approx. 1070kg | |
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High-Speed IC Test HandlerModel: NS7000 series
Features: 1) High-Speed: Max. 7300UPH (Octal) 2) Wide version for wider socket pitch 3) Stable Pick & Place of Small Devices (Min. 3x3mm) 4) Changeover Kits compatible with the other NS-series 5) Easy Operation / Easy Maintenance 6) Flexible Socket Pitch with Easy Changeover |
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Basic Specifications |
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| Model | NS7000 | NS7080 | NS7080SW | NS7160W |
| Device Type / Size |
QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Min. 2x2mm – Max. 50x50mm (Lead Pitch: 0.4mm or more) |
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| Test Mode |
Square Quad (2×2) Inline Quad (1×4) Dual / Single |
Octal (4×2) Square Quad (2×2) Inline Quad (1×4) Dual / Single |
16 sites (8×2)
Octal (4×2) Square Quad (2×2) Inline Quad (1×4) Dual / Single |
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| Socket Area | 184 x 130mm | 260 x 130mm | ||
| Standard Socket Pitch |
Square Quad: 80mm (X) x 60mm (Y) Inline Quad: 40mm (X) Dual: 80mm (X) |
16 sites (optional): 30mm (X) x 60mm (Y) Wide Octal: 60mm (X) x 60mm (Y) Standard Octal: 40mm (X) x 60mm (Y) |
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| Heating Method | Heating Chamber | |||
| Min. Index Time |
0.36 sec. (Inline Quad / Dual / Single) 0.39 sec. (Square Quad / Octal / 16 sites) |
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| Max. Throughput | 7300UPH (Octal / Quad) | |||
| Temperature |
Ambient / Hot +50°C – +90°C ±2°C +90°C – +130°C ±3°C |
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| Standard Tray Size | JEDEC Trays (135.9 x 315.0mm) | |||
| Binning | 6 Hardware Binning (3 Auto / 3 Manual) | 5 Hardware Binning (3 Auto / 2 Manual) | ||
| Power | Single-Phase AC200-240V 50/60Hz 6kVA | |||
| Dimensions | 1640(W) x 1580(D) x 1860(H) mm | 1800(W) x 1580(D) x 1860(H) mm | ||
| Weight | Approx. 1120kg | Approx. 1190kg | ||
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High-Speed IC Test HandlerModel: TR60
Features: 1) Tri-Temp. Capability (-60 – +140°C) 2) Stable Pick & Place of Small Devices (Min. 3x3mm) 3) Loadboard Compatible with NS-series 4) Max. Throughput: 4000UPH 5) Vertical Docking |
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Basic Specifications |
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| Model | TR60 |
| Device Type / Size |
QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Min. 2x2mm – Max. 32x32mm (Lead Pitch: 0.4mm or more) |
| Test Mode |
Square Quad (2×2) Inline Quad (1×4) Dual / Single |
| Standard Socket Pitch |
Square Quad: 80mm (X) x 60mm (Y) Inline Quad: 40mm (X) Dual: 80mm (X) |
| Min. Index Time | 0.65 sec. |
| Max. Throughput | 4000UPH (Quad) |
| Temperature |
-40°C – +140°C ±4°C (Standard) -60°C – -40°C ±5°C (Optical) |
| Standard Tray Size | JEDEC Trays (135.9 x 315.0mm) |
| Binning |
6 Hardware Binning (3 Auto / 3 Manual) 15 Software Binning |
| Power | Triple-Phase AC200-240V 50/60Hz 10kVA |
| Dimensions | 1570(W) x 1270(D) x 1880(H) mm |
| Weight | Approx. 1200kg |
